FC150 Platinum: High-AccuracyFlip-Chip Bonding for Next-Generation Device Integration
The FC150 Platinum is a high-accuracy flip-chip and die bonder designed for applications in photonics, optoelectronics, infrared focal plane arrays, quantum computing, MEMS, and 3D integration. The system supports chip-to-chip and chip-to-wafer bonding with a post-bond accuracy of ±0.7 µm. Its rigid granite base, air-bearing stages, high-resolution optical alignment, and active leveling ensures sub-micron alignment accuracy and long-term stability. The platform provides bonding forces from 0.25 N to 2,000 N and temperatures up to 450°C with independent control of chip and substrate heating. It supports a wide range of processes including room temperature compression, thermo-compression, solder reflow, and adhesive bonding. Options including automatic calibration, advanced optical leveling, process recording, formic acid vapor system, fluid dispenser, flux dipping station, and chip flipper can be customized depending on the application. The FC150 Platinum is an ideal solution for R&D, prototyping, and high-value manufacturing requiring exceptional alignment accuracy and process flexibility
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